Phone CPU BGA Reballing Stencil Reball Rework Template Screen for Samsung A60?A90

Feature: 1. Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. 2. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3. Perfect Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60?A90 series, A10S, A605F, A705F and more. 4. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5. Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it. Specification: Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU. Applicable Product Model: For A60A90 series, A10S, A605F, A705F, A920F. . Package List: 1 x Phone CPU BGA Reballing StencilQuick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. Perfect Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60?A90 series, A10S, A605F, A705F and more. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.