BGA Flux Paste Soldering Flux for Mobile Phone Repair Soldering No Clean High Activity for Electronics LED Soldering

Features: Delivers soldering with convenience and high activity for mobile phone PCB repairs and rework applications. This advanced flux gel eliminates traditional preparation/cleaning steps through its stable adhesion and optimized viscosity, formulated with premium rosin for soldering on components. Professional repair technicians and electronics manufacturers will appreciate its reliability when handling smartphone LED repairs, chip replacements, and intricate PCB circuit maintenance. Essential for mobile device refurbishment workshops, reballing stations, and PCB assembly lines requiring in delicate soldering environments. Engineered to enhancing solder joint integrity across multiple thermal cycles, ensures efficient workflow optimization for flux applications and soldering projects.

Specifications: Component:Metal Size:Approx.2.8x9.6cm/1.1x3.78inch

Package Includes: 1 Set Solder cream

note: 1.Please allow 1-2cm errors due to manual measurement, making sure that you not mind before order. 2.Due to the differences between different monitors, the picture may not reflect the actual of the item.